Asahi Glass Fused Silica materials are used throughout the electronics industry and provide extraordinary high purity, chemical stability, low CTE, and high optical transmittance. These properties make Asahi's fused silica materials the ideal choice for photomask substrates, lenses for excimer steppers, and glass wafers for high-temperature p-Si TFTs.

AGC's low OH fused silica materials have high optical transparency which makes them the preferred choice for photolithography processes from i-line technologies (365nm) down to 193 nm (ArF) for both dry and immersion. Additionally, AGC is the world leader in next-generation technologies including low OH fused silica materials for EUV (135nm) lithography. AGC low OH fused silica is inclusion free and exhibit the best homogeneity and laser durability in the world.