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Upcoming Events
IMAPS NW Chapter Spring Technical Symposium
May 31, 2012 AGC presenting: Through Glass Via (TGV) and Through Quartz Via (TQV) for Wafer Level and RF High Frequency Packaging Biotronik (MSEI) Lake Oswego, OR
IMAPS 2012 - 45th International Symposium on Microelectronics
September 9 – 13 San Diego Town & Country Convention Center San Diego, CA
IWLPC 2012 – International Wafer-Level Packaging Conference
November 7 – 8 Double Tree Hotel San Jose, CA |








